For a Superior Quality Board!

Metallic Resources' standard bar solder is manufactured from electrolytically processed tin and lead to create solder so pure it far exceeds the most common specification requirements. High purity makes it especially beneficial to hot air leveling applications and high production rate operations that require consistent and reliable performance. It is primarily used in printed circuit board fabricating operations common to the electronics market. Solder pots using electrolytic solder can be operated at lower temperatures to provide energy savings, extended pot life, reduced thermal stress, and reduced potential of contamination. Lower viscosity improves the fluidity, which in turn improves the solder's wetting capability as well as reducing necessary rework. In a PC Fabrication process, where the bare board is being manufactured, the use of electrolytic solder in a hot air leveler results in a smoother, more uniform deposition of solder on the copper surface of the board. The electrolytic manufacturing process assures batch-to-batch consistency for predictable solder performance in the solder pot. The process removes metallic and non-metallic impurities often found in "virgin metals" and reclaimed solders to provide a purer tin/lead solder. This purity results in a smaller crystalline structure which exhibits a shinier, more brilliant solder appearance.